application fields:currently mainly used in wafer bearing device, battery cover plate, high temperature wire, coaxial cable, lighting wire, injection molding products for using in complex environment, lvds wire, etc.
precautions for production
*before production,dry for 2 hours with temperature 120℃.
*the equipment using this product must be thoroughly cleaned and any residue shall not be kept inside it.
*this product is used for industrial purposes only.safety is not assured when it is used for other purposes.